MEMS (Professional Elective – II) B.Tech. IV Year I Sem JNTUH R-18

• Explain the key benefits and driving forces behind the miniaturization of devices in the context of MEMS technology.

• Compare and contrast different scaling laws and their impact on the performance and design of micro devices.

• Describe the fundamental steps involved in microfabrication, including deposition, etching, lithography, and diffusion.

• Analyze the advantages and limitations of different bulk and surface micromachining techniques for specific MEMS applications.

Unit II: Surface Micromachining and Bulk Micromachining

• Explain the basic process flow of surface micromachining, highlighting key challenges like stiction and residual stress.

• Compare and contrast LIGA, wet etch-based, and dissolved wafer bulk micromachining processes.

• Discuss the advantages and limitations of silicon-on-insulator (SOI) and sacrificial layer etching methods in bulk micromachining.

• Analyze the role of electroplating in MEMS fabrication and its limitations due to residual stress and material properties.

Unit III: Mechanics of MEMS Materials

• Relate the concepts of stress, strain, and material properties to the design and performance of MEMS devices.

• Analyze the bending moment, strain, and flexural rigidity of microstructures under different loading conditions.

• Explain the impact of residual stress and different spring combinations on the behavior of MEMS devices.

• Discuss methods for characterizing and measuring mechanical parameters of MEMS materials.

Unit IV: MEMS Devices

• Explain the working principles and design considerations of commonly used MEMS sensors like pressure sensors, accelerometers, and gyroscopes.

• Analyze the advantages and limitations of different actuation mechanisms like electrostatic, piezoelectric, shape memory alloy (SMA), and thermoelectric.

• Discuss the design and functionality of RF MEMS switches and their applications in communication systems.

• Evaluate the performance and challenges of microfluidic devices like micropumps and microvalves used in Lab-on-a-Chip applications.

Unit V: Fluid Dynamics and Micro Pumps

• Apply the principles of fluid dynamics, including viscosity, density, surface tension, and Navier-Stokes equations, to analyze microfluidic flows.

• Differentiate between different flow types (laminar, turbulent) and their impact on microfluidic device performance.

• Explain the working principles and design factors of various micropump designs based on electrokinetic, piezoelectric, and other actuation mechanisms.

• Discuss the challenges and future directions of integrating microfluidics with MEMS devices for miniaturized Lab-on-a-Chip applications.

Bonus Questions:

• Analyze the impact of advancements in nanotechnology on the development of next-generation MEMS devices.

• Discuss the ethical considerations and potential risks associated with the widespread use of MEMS technology.

• Identify and research new and emerging applications of MEMS beyond traditional fields like microelectronics and biomedical engineering.